TWHM 2024

15th Topical Workshop on

Heterostructure Microelectronics

TWHM2024

inoue

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2nd CFP
Submission of Papers
Keynote and Invited Speakers
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Venue
Workshop Schedule
Technical Program
Flight and Transportation Information
Presenter's Information
Information for Participants

 


SUBMISSION OF PAPERS

PREPARING ABSTRACT

  • Please prepare a two-page abstract written in English in A4 or Letter size. Only PDF format less than 5 MB is acceptable. DO NOT encode or compress the file.
  • Your abstract must clearly and concisely state the specific results of your work with appropriate figures and key references within the two-page limit. Write the paper title, author(s), affiliation(s), corresponding e-mail address on the first page.
  • DO NOT use two-byte characters in both figures and texts.
  • All the colored artworks will be reflected as colored.
  • Please prepare an application form along with your abstract.

Abstract example will be available here.
Abstract template will be available here.
Application form will be available here.

SUBMIT ABSTRACT & APPLICATION FORM

  • Please submit the two-page abstract in PDF format and the application form in Word format via e-mail to

twhm-abst@rciqe.hokudai.ac.jp

IMPORTANT DATES

  • Abstract Submission Deadline:
            April 27  May 18, 2024 for contributed papers
            June 10, 2024 for invited papers
  • Notification of Acceptance for contributed papers: June 10, 2024

TERMS & CONDITIONS

Authors of accepted papers are required to agree to the following terms and conditions.
  • The copyright of abstracts, presentation materials belong to the authors.
  • TWHM will not be responsible or reliable if abstracts and/or presentation materials infringe on a third party's copyrights and other intellectual property rights.
  • TWHM may occasionally use your registered email address to send information on TWHM.

 

 

 
Workshop Exhibitor

novelcrystal

silvaco

vectorsemiconductor

NPS

Hisol