TWHM 2019
13th Topical Workshop on Heterostructure Microelectronics

TWHM2019

Home
1st CFP
Submission of Papers
Keynote and Invited Speakers
Registration and Hotel information
Committee
Venue
Workshop Schedule
Technical Program
Flight and Transportation Information
Presenter's Information
Contact
Link

SUBMISSION OF PAPERS

To present a paper, please submit two-page abstract written in English in A4 or Letter size. Your abstract must clearly and concisely state the specific results of your work. Within the two-page limit, the abstract should include appropriate figures and key references (example file: abst-example.pdf). In addition, we would like to ask to prepare an Application Form (Application-form.doc).

Pelase send the two-page abstract in PDF format and an application form in Word format
via e-mail to
twhm-abst@rciqe.hokudai.ac.jp

Abstract Submission Deadline: April 25, 2019
Notification of Acceptance: July 1, 2019